Directory Sites

  • Fine Semi Tech

    Pellicles for photomask processing, chillers, pellicle mounters for semiconductor and FPD processing.

    www.fstc.co.kr

  • Cascade Microtech

    Manufacturer of probe stations and low current wafer probing solutions from probe cards to RF microwave prober applications.

    www.cmicro.com

  • K.C.TECH Co., Ltd

    Gas cabinet, wet stations. Flash site.

    www.kctech.co.kr

  • DNS Korea Co., Ltd.

    Wet cleaning system, spinners, developers and other semiconductor equipment and FPD equipment.

    www.kdns.co.kr

  • Electro Mechanical Services

    Supplier of technical products and services to laboratories and manufacturers in New Mexico.

    www.emsi-usa.com

  • Varian Semiconductor Equipment Associates

    Offer high current, medium current, high energy fab tools, including ion implanters.

    www.vsea.com

  • Episil Technologies Inc.

    Manufacturer of silicon epitaxial wafers foundry and provide buried layer epitaxial process services.

    www.episil.com

  • Felcon Cleanrooms and Containment Ltd

    Contamination controls including wet benches, cleanrooms, downflow, and laminar flow booths.

    www.felcon.co.uk

  • Visual Photonics Epitaxy Co., Ltd.

    Manufacturer of MOCVD technology based EPI materials.

    www.vpec.com.tw

  • Greatek Technology Co., Ltd.

    Designer and manufacturer of semiconductor process equipment.

    www.greatek-tech.com.tw

  • Orbis Technologies Ltd

    Providers of plasma coating, etching, ashing and metallization products. Applications include semiconductor manufacturing.

    www.orbitech.co.uk

  • Joosung Engineering Inc.

    Chemical vapor deposition (CVD) equipment for semiconductor and LCD processing.

    www.jseng.com

  • Cost Effective Equipment

    Manufactures spin coaters, spinners, spincoaters, developers, hotplates and other semiconductor wafer processing equipment. A division of Brewer Science Inc.

    www.brewerscience.com

  • RD Automation Flip Chip Die bonders

    Manufacturer of flip chip die bonding equipment. Offers manual, semi-automatic to inline production models. Common applications: FPA, MCM, FCOG, Eutectic bonding. Various options available.

    www.rdautomation.com

  • Nikon

    Photo lithography systems for semiconductor and fpd processing

    www.nikon.co.jp

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