Electrochemical migration

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It has been suggested that this article or section be merged into Printed circuit board. (Discuss)

Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias.

[1] IPC Publication IPC-TR-476A, “Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies,” Northbrook, IL, May 1997.

[2] S.Zhan, M. H. Azarian and M. Pecht, "Reliability Issues of No-Clean Flux Technology with Lead-free Solder Alloy for High Density Printed Circuit Boards", 38th International Symposium on Microelectronics, pp. 367-375, Philadelphia, PA, September 25-29, 2005.

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