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Flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.

The FC-PGA package is used on certain Intel Celeron, Pentium III, and Pentium 4 family microprocessors. FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478 motherboard sockets; similar packages have also been used by AMD.

FC-PGA packaging is used by Pentium III processors, and Celeron 533, unofficially called 533A, processors onward. Earlier Celeron processors used PPGA packaging, the fastest was at 533 MHz.

FC-PGA2, adds a heat spreader over the silicon core and is used on late Pentium III processors and most Pentium 4 and Celeron processors using Socket 478 (180nm Willamette and 130nm Northwood). FC-PGA4 is used by Intel Pentium 4 and Celeron D processors using 90 nm process (Prescott based) also with integrated heat spreader. Intel Mobile Pentium 4-M processors did not have the integrated heat spreader and so use FC-PGA packaging.

Intel replaced FC-PGA style packaging with the land grid array (LGA775) or FC-LGA4 packaging on Prescott-based Pentium 4 and Celeron D processors which no longer have pins.

The micro-FCPGA (flip-chip plastic grid array) package consists of a die placed face-down on an organic substrate. An epoxy material surrounds the die, forming a smooth, relatively clear fillet. The package uses 478 pins, which are 2.03 mm long and .32 mm in diameter. While there are several micro-FCPGA socket designs available, all of them are designed to allow zero-insertion force removal and insertion of the processor. Different from micro-PGA, the micro-FCPGA does not have an interposer and it includes capacitors on the bottom side.

• CPGA
• Pin grid array
• Wikihowto: Guide to IC packages
• Intel CPU Processor Identification